Press release

“The Covered Bond Label Welcomes Pekao Bank Hipoteczny S.A.”

30 August 2018

“The Covered Bond Label Welcomes Pekao Bank Hipoteczny S.A.”

PRESS RELEASE

 Brussels, 30 August 2018 – For immediate release

 

The Covered Bond Label Foundation (CBLF) is pleased to announce that Pekao Bank Hipoteczny S.A. has joined the Covered Bond Label.

Currently, the total number of cover pools under the Covered Bond Label stands at 120 across 18 jurisdictions globally.

Luca Bertalot, Covered Bond Label Foundation Administrator, said:

“We are delighted to welcome Pekao Bank Hipoteczny S.A. to the Covered Bond Label family. As the 3rd issuer to join the Label from the rapidly growing Polish covered bond market, this is a clear statement of the market’s commitment to achieving the highest standards of investor transparency. Together we are taking another significant step forward towards the implementation of the Capital Markets Union as 100% of the Polish covered bond market now has a Covered Bond Label.”

 Rafał Litwińczuk, Member of the Board, CFO of Pekao Bank Hipoteczny S.A., said: 

By joining The Covered Bond Label we boost transparency and confidence among market participants for both of our programs: Mortgage Covered Bonds and Public Covered Bonds.

The Covered Bond Label is a quality label, the purpose of which is to highlight the security and quality of covered bonds to investors and to further enhance recognition of and trust in the covered bond asset class.

 The Covered Bond Label is open to all covered bond programmes that are compliant with the Covered Bond Label Convention and disclose their data by publishing the Harmonised Transparency Template (HTT).

More information on all labelled issuers and the Label itself can be found on the Covered Bond Label website at www.coveredbondlabel.com.

Contact:

Luca Bertalot

Covered Bond Label Foundation (CBLF)

Tel. +32 2 285 40 35

info@coveredbondlabel.com

www.coveredbondlabel.com

 

This Press Release is available on the Covered Bond Label website here.